In a quality-assurance analysis of a manufacturing run of 1.5 × 108 micro-sensors for an aerospace project, it is estimated that 0.024% of the sensors will fail during thermal stress testing. Of the sensors that fail, 3 out of 8 fail due to silicon substrate micro-cracking, while the remainder fail due to wire bond degradation.
Which of the following is the best estimate for the number of sensors that fail due to wire bond degradation?
13,50013,50013,500
22,50022,50022,500
135,000135,000135,000
225,000225,000225,000
