A quality control engineer monitors a semiconductor fabrication process for two specific types of defects: alignment errors ($E_A$) and bonding errors ($E_B$).

Data from the production line indicates that: $P(E_A\cap E_B)=0.15$ $P(E_A^{\prime }\cap E_B^{\prime })=0.25$ $P(E_B)=2P(E_A)$