Within the global digital economy, the production of advanced semiconductor microchips involves an extraordinary degree of international specialisation and division of labour. For instance, ASML in the Netherlands specialises in extreme ultraviolet (EUV) lithography systems, TSMC in Taiwan handles high-precision fabrication of physical silicon wafers, and chip-design firms in Silicon Valley program instruction architectures. Even within a single fabrication facility, operations are split into thousands of micro-tasks, from cleanroom chemical engineering to nanometer-scale photolithography testing.